As AI workloads continue to grow, data centres are reaching their limits for power delivery. Most still operate on 54V power systems, which can no longer efficiently serve racks exceeding 200 kilowatts.
To meet future demand, the industry is moving toward 800V High Voltage Direct Current (HVDC) architectures, systems that can handle much higher power with greater efficiency. Skycore Semiconductors is tackling this exact problem.
This Danish startup just raised €5 million in seed funding to develop advanced power chips designed for the new generation of AI data centres. The round was led by the Amadeus APEX Technology Fund, with participation from First Momentum, Mätch VC, and Balnord.
Combined with earlier funding and grants, Skycore has now raised around €7.5 million since its launch. Previous investors include Morph Capital and Thorbjørn Rønje, who contributed to the initial €2.5 million in funding and grants.
Solving the power problem behind AI’s explosive growth
Founded in Denmark by Pere Llimós Muntal, Dennis Øland Larsen, Thomas Souvignet, and Guifré Vendrell Pausas, Skycore Semiconductors has developed a Power IC technology platform that enables the development of power solutions for applications with extreme power density and efficiency demands.
The company’s Power IC solutions deliver extreme power density and efficiency in a compact and flat form factor, addressing a critical bottleneck in scaling AI infrastructure.
“Scaling today’s AI compute infrastructure requires a fundamental change in how data centres are powered, and 800V HVDC power architectures are the first step on that path. Our Power IC technology platform delivers power solutions with extreme power density and efficiency in flat, compact form factors, all essential to enable HVDC architectures.
We design our solutions to be inherently scalable to meet the evolving demands of future power architectures,” said Pere Llimós Muntal, CEO and Co-founder of Skycore Semiconductors.
Direct competitors include large power semiconductor vendors developing 800V HVDC chips and reference designs, as well as system power suppliers integrating those chips into rack- and facility-level solutions for AI data centres. Core silicon rivals are Infineon, STMicroelectronics, Texas Instruments, Analogue Devices, ROHM, Renesas, ON Semiconductor, Navitas, MPS, InnoSemi, and ST/TI collaborators with NVIDIA on 800V HVDC.
What’s next?
The new funding will help the company expand its team, accelerate product development, grow its manufacturing capabilities, and strengthen its patent portfolio. Skycore also plans to work closely with strategic partners in the fast-growing AI infrastructure market.
The company aims to establish a robust and scalable supply chain and execute co-development projects with potential customers, strengthening commercial engagement.
